SOLDER WICK 2.0MM×25M
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SOLDER WICK 2.0MM×25M

SKU: HFR551-20250-E

Availability:

Available for order*

SOLDER WICK <NO CLEAN/HALOGEN FREE> 2.0MM×25M

Economical and easy-to-use Desolder braid
Handy for the removal of solder after dismounting surface-mounted components including BGAs

£39.00 Excl. VAT

Available for order*

A minimum sub total of £250.00 is required, You need an additional £250.00 to proceed through to the checkout.

For customers in the Republic of Ireland, please contact us for a quote including shipping and customs charges.

Request quote
Faster thermal transmission for superior performance at lower temperature and with lower wattage soldering irons.
Three different
Regular type: Rosin flux treated copper braid
Unflux type: Untreated copper braid
No clean type: Low residue flux treated copper braid
Using ESD SAFE package

Removal for thru-hole…

H K Wentworth - HAKKO UK and Ireland distributor

Removal for bridging…

H K Wentworth - HAKKO UK and Ireland distributor

Usage/Applications

Desoldering wire is used to remove solder from an elemental device or from patterns on a printed circuit board (PCB) from which surface-mounted devices such as BGA (ball grid array) have been removed.

Trick to remove solder well with the desoldering wire
Wrong use of the desoldering wire may tear patterns from a PCB or damage discrete components. In order to prevent these problems, make sure to take the preventive measure below:

  1. Apply a bit of solder to the tip of solder iron.
  2. Apply a bit of solder to the tip of the desoldering wire. Cut the soldered tip of the wire at an angle of 45 degrees. Solder should remain attached.

Preliminary soldering improves heat conductance.

H K Wentworth - HAKKO UK and Ireland distributorPress the desoldering wire with the soldering iron on the wire
Be careful not to press the soldering tip down for too long. Otherwise, the pattern will come off.
Remove the desoldering wire and soldering iron at the same time.
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